Subdivision of Land or Platting (Major vs. Minor)

Subdivision of land (commonly referred to as subdivision platting) is the process of splitting a tract of land into smaller parcels and is reviewed by the governmental agency that oversees this process. There are two forms of subdivision being major subdivision and minor subdivision with minor typically being 5 lots or less and Major typically involving the construction of a roadway for either Public or Private use. The complexity of each form typically depends to the jurisdiction reviewing as each has independent rules and requirements that must be met. All major subdivisions have a topographic survey involved to provide elements needs for design of roadway, drainage and utilities to provide access for the subdivision itself.

Our Drone division aides in the process to ensure timely delivery of the topographic survey for both design and overall planning, while providing an accurate boundary survey to provide the framework for the overall design and layout of planned lots. Polysurveying provides speed and accuracy to the engineer performing the design to ensure that the developer gets his or her plans into a design phase much faster than use of older traditional methods of cutting line or brush cutting which is time consuming and not cost effective. Lastly, the platting process to provide an overall layout map that shows building setbacks, easements, wetlands, and other features is produced to allow the developer to sell lots once recorded into the court records. The completion of this process allows the developer to begin to sell lots and provide future homesites for builders and buyers alike.